Development of edgeless TSV X-ray detectors

We report about the activity and progress on the development of TSV edgeless detectors at DESY. One part of the development is Through Silicon Via (TSV) technology for the Medipix3RX readout chip (ROC). TSV technology is a concept of connecting readout chips to readout electronics. Instead of wire-bonding...

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Multi-Foil X–ray optics tests at PANTER: Preliminary results

We present and discuss preliminary test results performed withselected modules of Multi–Foil X–ray Optics in the MPE PANTER X–raytest facility. Three X–ray optics Multi–Foil modules were tested, namely 1DKirkpatrick-Baez module, 2D Kirkpatrick-Baez module, both developed within the EU Horizon 2020...

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Thermal vacuum testing of Timepix3 detector

The thermal dependence of semiconductor detectors is one of their critical properties. This paper presents the results of the Timepix3 detector thermal vacuum testing, with respect to the effects on its properties and sensitivity. The Timepix3 represents a new generation of Timepix chips of the Medipix...

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Single layer Compton camera based on Timepix3 technology

The Compton camera concept is based on reconstruction of recorded Compton scattering events for incoming gamma rays. The camera usually consist of two or more position (2D) and energy sensitive detectors. The Compton scattering of the incoming gamma ray recoiling an electron occurs in the first detector....

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