The Extremely Brilliant Source (EBS) upgrade of the European Synchrotron Radiation Facility (ESRF) sets new requirements for the detection schemes used in various beamlines. In order to facilitate direct x-ray detection at moderate and high energies in the range of 30–100 keV we investigate the performance...

In this paper the design and implementation of a novel portable X-ray imager system is presented. The design features a direct X-ray detection scheme by making use of a hybrid detector (Medipix3RX). Taking advantages of the capabilities of the Medipix3RX, like a high resolution, zero dead-time, single...

With the examples of developments carried out in the Kurchatov Institute and by the world leaders in the field the presentation considers the devices and methods to obtain remotely information on the distribution of radioactivity in radwaste and SNF. It describes the different types of light portable...

The tissue type resolving X-ray radiography and tomography can be performed even without contrast agents. The differences between soft tissue types such as kidney, muscles, fat, liver, brain and spleen were measured based on their spectral response. The Timepix based X-ray imaging detector WidePIX2×5 with...

The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenges to the ATLAS tracker. The current Inner Detector will be replaced with an all-silicon tracker which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected...

In order to meet the needs of some ESRF beamlines for highly efficient 2D X-ray detectors in the 20–50 keV range, GaAs:Cr pixel sensors coupled to TIMEPIX readout chips were implemented into a MAXIPIX detector. Use of GaAs:Cr sensor material is intended to overcome the limitations of Si (low absorption)...

We report about the activity and progress on the development of TSV edgeless detectors at DESY. One part of the development is Through Silicon Via (TSV) technology for the Medipix3RX readout chip (ROC). TSV technology is a concept of connecting readout chips to readout electronics. Instead of wire-bonding...

We present and discuss preliminary test results performed withselected modules of Multi–Foil X–ray Optics in the MPE PANTER X–raytest facility. Three X–ray optics Multi–Foil modules were tested, namely 1DKirkpatrick-Baez module, 2D Kirkpatrick-Baez module, both developed within the EU Horizon 2020...

Fast tomography measurements are still done almost exclusively within the domain of synchrotrons. However, recent progress in radio diagnostic instrumentation has enabled researchers to perform time-lapse computed tomography (4-D CT) even under laboratory conditions with standard X-ray sources. Thus,...