Silicon pixel R&D for CLIC

Challenging detector requirements are imposed by the physics goals at the future multi-TeV e+ e− Compact Linear Collider (CLIC). A single point resolution of 3 μm for the vertex detector and 7 μm for the tracker is required. Moreover, the CLIC vertex detector and tracker need to be extremely light...

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Katherine: Ethernet Embedded Readout Interface for Timepix3

The Timepix3—the latest generation of hybrid particle pixel detectors of Medipix family—yields a lot of new possibilities, i.e. a high hit-rate, a time resolution of 1.56 ns, event data-driven readout mode, and the capability of measuring the Time-over-Threshold (ToT – energy) and the Time-of-Arrival...

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Progress on TSV technology for Medipix3RX chip

The progress of Through Silicon Via (TSV) technology for Medipix3RX chip done at DESY is presented here. The goal of this development is to replace the wire bonds in X-ray detectors with TSVs, in order to reduce the dead area between detectors. We obtained the first working chips assembled together...

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Vertex-Detector R&D for CLIC

A detector concept based on hybrid pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors (planar or active HV-CMOS) via low-mass interconnects....

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