Test beam analysis of ultra-thin hybrid pixel detector assemblies with Timepix readout ASICs
The requirements for the vertex detector at the proposed Compact Linear Collider imply a very small material budget: less than 0.2% of a radiation length per detection layer including services and mechanical supports. We present here a study using Timepix readout ASICs hybridised to pixel sensors of 50500µm thickness, including assemblies with 100µm thick
sensors bonded to thinned 100µm thick ASICs. Sensors from three producers (Advacam, Micron Semiconductor Ltd, Canberra) with different edge termination technologies (active edge, slim edge) were bonded to Timepix ASICs. These devices were characterised with the EUDET telescope at the DESY II test beam using 5.6 GeV electrons. Their performance for
the detection and tracking of minimum ionising particles was evaluated in terms of charge sharing, detection efficiency, single-point resolution and energy deposition.
Alipour Tehrani, N., Redford, S., Benoit, M., Kulis, S., Dannheim, D., Sicking, E., & Firu, E. (2016). Test beam analysis of ultra-thin hybrid pixel detector assemblies with Timepix readout ASICs (No. CLICdp-Note-2016-001).