Katherine: Ethernet Embedded Readout Interface for Timepix3

The Timepix3—the latest generation of hybrid particle pixel detectors of Medipix family—yields a lot of new possibilities, i.e. a high hit-rate, a time resolution of 1.56 ns, event data-driven readout mode, and the capability of measuring the Time-over-Threshold (ToT – energy) and the Time-of-Arrival...

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Progress on TSV technology for Medipix3RX chip

The progress of Through Silicon Via (TSV) technology for Medipix3RX chip done at DESY is presented here. The goal of this development is to replace the wire bonds in X-ray detectors with TSVs, in order to reduce the dead area between detectors. We obtained the first working chips assembled together...

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Vertex-Detector R&D for CLIC

A detector concept based on hybrid pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors (planar or active HV-CMOS) via low-mass interconnects....

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First tests with Timepix2 and heavy ions

We investigate the response of the new Timepix2 chip to heavy ions. Understanding this response is important to understand the performance and capabilities of this chip in the space environment, where it is a possible replacement for the existing Timepix chip which is already widely used in space....

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