AdvaPIX

Advapix

Advacam’s AdvaPIX camera is designed with special emphasis to performance and versatility that is often required in scientific research world. The camera module contains a single Timepix device with a quick parallel readout. It allows a sustainable frame rate of up to 1700 frames/ second that makes it optimal for spectral imaging and ion detection. Advanced data processing algorithms allow ion detection with spatial resolution of up to 200 nm.

Description

Advacam’s AdvaPIX can be used in variety of applications such as fast radiography (X-rays, neutrons, ions), particle tracking, spectroscopic imaging (each pixel records the energy spectrum), Time-of-flight imaging, multilayer Compton camera (thin top sensor, thick bottom sensor). The sensor type and thickness can be customized as per requirements and can also be modified for neutron imaging by depositing converter layer (6LiF). The sensors can be adapted for neutron imaging by deposition of converter layers. The spatial resolution in some applications, like thermal neutrons, can reach units of microns or even submicrometric level (ions).

The fast modules with Si or CdTe pixel detectors Timepix can be used in different configurations such as stack of several layers or tiling to cover larger area or combination of both. Each module contains single Timepix device with fast parallel readout up to per second independent of frame occupancy. A separate USB 3.0 communication channel for each device assures fast read-out of the whole modular system. All modules in the system can be operated synchronously or triggered independently.

  • Sensor Material: Si or CdTe
  • Sensor Thickness: 100 μm, 300 μm and 500 μm for Si; 1 mm for CdTe
  • Sensitive Area: 14 mm x 14 mm
  • Number of Pixels: 256 x 256
  • Pixel Pitch: 55 μm
  • Resolution: 9 lp/mm
  • Readout Speed: 1700 frames/s
  • Photon Counting Speed: Up to 3 x 106 photons/s/pixel
  • Threshold Step Resolution: 0.1 keV
  • Energy Resolution: 0.8 keV (THL) and 2 keV (ToT)
  • Min Detectable Energy: 5 keV for X-rays
  • Readout Chip: Timepix
  • Pixel Mode of Operation: Counting, Time-over-Threshold, Time-of -Arrival
  • Connectivity: USB 3.0
  • Weight: 503 g
  • Dimensions: 125 mm x 79 mm x 25.5 mm (L x W x H)
  • Software: Pixet PRO

Documents


Device parameters

Operating Conditions

Symbol Parameter Min Typ Max Units Comment
TA Temperature Range 0 50 70 °C  
Φ Humidity     60 % Not condensing

Electrical Specification

TA = 25°C, USB voltage VCC = 4.8V

Symbol Parameter Min Typ Max Units Comment
VCC Supply Voltage 4.0 5.0 5.5 V  
ICC Supply Current          
ICC1 Chip active   800 1500 mA  
P1 Power Dissipation     7.5 W  
I/O Conn. Input CMOS (pin 4,6,8,10)          
VINL Voltage Low 0   1.15 V  
VINH Voltage High 2.15   3.3 V  
I/O Conn. Input LVDS (pin 3,5,7,9)          
VIN Voltage Range 0   2.5 V  
VINDIFF Differential Voltage 250   600 mA  
Bias Voltage Source for Sensor Diode          
VBIAS Bias Voltage 0   ±450 V Polarity is sensor dependent

Performance Characteristics for Timepix

Symbol Parameter Min Typ Max Units Comment
f Frame Rate     1700 fps with USB 3.0 cable
TREAD Frame Readout Time1   588   μs with USB 3.0 cable
dT Time resolution 20 100   ns  

Sensor parameters

TA = 25°C

Symbol Parameter Si CdTe Units Comment
  Thickness 100 300 500 675 1000 µm  
σ Energy resolution of energy discrimination threshold (σ @ 23 keV) 0.5 1.1 keV  
σ Energy resolution of energy discrimination threshold (σ @ 60 keV) 0.6 1.5 keV  
σ Energy resolution in full spectral mode (σ @ 23 keV) 0.7 3.0 keV  
σ Energy resolution in full spectral mode (σ @ 60 keV) 1.0 3.6 keV  
  Typical detectable energy range for X-rays2 5 to 60 5 to 600 keV See chart below
  Pixel size 55 55 µm  

Device Description

+5VDC connector

Main power supply (via standard 2.1 mm connector). Connect after plugging USB connector.

USB connector

USB type micro B, Standard USB 3.0 Super-Speed.

I/O Digital connector

Connector is available internally on board. It can be made accessible upon request.

1 GND   2 Max  
3 Reserved LVDS0P (2.5V) 4 Ready In CMOS 0-5V
5 Reserved LVDS0N (2.5V) 6 Trigger In CMOS 0-5V
7 Reserved LVDS1P (2.5V) 8 Ready Out CMOS 0-5V
9 Reserved LVDS1N (2.5V) 10 Trigger Out CMOS 0-5V

Mechanical Dimensions

Without protection cover:

All dimensions are in mm.
 

With protection cover:

All dimensions are in mm.
 

1 Convertors based on 6LiF or 10B4C for slow neutrons (efficiency up to 4%) or PE for fast neutrons.
2 A final picture can be created as sum of individual images. The dynamic range is limited only by the measurement time.
3 During Readout time (or Dead time), no charge is collected from the sensor.
4 The maximum detectable energy is limited only by sensitivity of the selected sensor for the given radiation type. The maximum measured energy can reach several MeV in case of heavy charged particles

1 During Readout time (or Dead time), no charge is collected from the sensor.
2 The maximum detectable energy is limited only by sensitivity of the selected sensor for the given radiation type. The maximum measured energy can reach several MeV in case of heavy charged particles


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