WidePIX 2×5 – MPX3

Widepix

Advacam’s WidePIX 2(1)x5 – MPX3 camera consists of either 2×5 or 1×5 Medipix3 devices. Each pixel has two 12-bit digital counters integrated together and two energy discrimination thresholds. To enhance dynamic range, both counters can be joined to a single 24-bit counter. The camera can be constructed with Si or CdTe edge-less sensor tiles. The edge-less sensor technology allows placing all tiles together from all sides, leaving no rifts. Thus the whole imaging area of the camera is fully sensitive to the radiation and does not have any gaps between the tiles in the image. The camera is made robust to address industrial users.

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Description

The Advacam’s WidePIX 1×5 – MPX3 camera has a built-in Time-Delayed-Integration (TDI) which proves to be very useful for scanning in industrial applications. It is very advantageous for continuous scanning. WidePIX 2(1)X5 – MPX3 is available with Si and CdTe sensors for imaging of the soft and hard X-ray spectrums, respectively. The particle counting principle eliminates any additional noise generated by the sensor or electronic readout. It allows acquiring X- ray images with very high contrast and wide dynamic range. Therefore, even low contrast structures such as plastic or soft tissue are easily detectable in X-ray images.
 
The minimum detectable energy is typically 3 keV for Si and 5 keV in case of CdTe sensor. The intrinsic spatial resolution of the camera is defined by pixel size which is 55 µm for WidePIX 1×5 – MPX3. The pixels situated on the border of tiles are 2 times bigger in one direction, while the corner pixels of tiles are 2 times larger in both directions. Both devices are suitable for CT scanners, which can take advantage of large sensitive area without any gaps.
 
The Time-Delayed-Integration mode enables online (continuous) scanning applications. The energy discrimination thresholds of Medipix3 technology allow spectral X-ray imaging. Different materials in an inspected sample could be then identified based on their spectral X-ray attenuation properties. Energy spectra could be measured typically from 5 keV upwards.
 
The Charge Summing Mode implemented in the pixel electronics provides hardware- based correction of signal cross talk between pixels. This further considerably improves the detector spectral response and therefore also quality of spectra measured in individual pixels. The camera is connected to a computer via USB 2.0 cable. The readout time is 50 (25) ms per frame resulting in maximum frame rate of 20 (50) frames per second.
 
  • Sensor Material: Si or CdTe
  • Sensor Thickness: 300 μm and 500 μm for Si; 1 mm for CdTe
  • Sensitive Area: 28 (14) x 70.4 mm
  • Number of Pixels: 512 (256) x 1280
  • Pixel Pitch: 55 μm
  • Resolution: 9 lp/mm
  • Readout Speed: 50 (1×5 tiles) and 20 (2×5 tiles) frames/s
  • Photon Counting Speed: up to 3 x 106 photons/s/pixel
  • Time-Delayed-Integration: Yes, hardware based (1×5 tiles)
  • Thresholds per pixel: 1, 2 or 8 (configurable)
  • Threshold Step Resolution: 0.1 keV
  • Energy Resolution: 0.7-2 keV (Si) and 1.2-3.6 (CdTe)
  • Min Detectable Energy: 2.5 keV (Si) and 5 keV (CdTe)
  • Readout Chip: Medipix3
  • Pixel Mode of Operation: Counting in Single Pixel Mode (SPM) or Charge Summing Mode (CSM)
  • Counter depth: 12 or 24 bits (configurable)
  • Connectivity: USB 2.0
  • Weight: 1800 g
  • Dimensions: 213 mm x 60 mm x 40 mm (L x W x H)
  • Software: Pixet Pro

Documents

Device parameters

Operating conditions

Symbol Parameter Min Typ Max Units Comment
TA Temperature Range 0 30 40 °C  
Φ Humidity   55 60 % Not condensing
  IP Code   IP50      

Family parameters

TA = 25°C, VCC = 24V

Symbol Parameter WidePIX 1×5 – MPX3 WidePIX 2×5 – MPX3 Units Comment
VCC Supply Voltage 20/24/26 V Min/Typ/Max
ICC Supply Current (VCC = 24V) 340/680 800/1600 mA Typ/Max
P Power dissipation 9/18 16/36 W Typ/Max
A Sensor Area 71.5 x 14.1 71.1 x 28.2 mm  
  Detector Resolution 256 x 1280 512 x 1280 Pixels  
f Frame Rate1 50 20 fps  
TREAD Readout Time2 20 50 ms  
m Weight 1700 1800 g  

Modes of readout chip operation

Type Mode Bit depth Description
Frame (reading all pixels) SPM-1Ch 12/24 bit/frame Single Pixel Mode using one counter: Every pixel works independently of its neighbours. One energy threshold (energy channel) is available. 1 output image: Number of events per pixel
SPM-2Ch 12 bit/frame Single Pixel Mode using both counters: Every pixel works independently of its neighbours. Two energy thresholds (energy channels) are available. 2 output images: Number of events per pixel
CSM 12/24 bit/frame Charge Summing Mode: The charge from 4 adjacent pixels is summed and is assigned to the pixel with the largest charge deposition. The event is counted only if the sum of singals exceeds the energy threshold. 1 output image: Number of events per pixel

All modes can be operated at two ranges: Broad / Narrow / Super Narrow3

Energy range and resolution

Typical values for 300 µm Silicon sensor, TA = 20°C.

Range Mode Min Energy [keV] Max Energy [keV] Resolution*@Cu- Kα (cca 8 keV) Resolution* @Zr- Kα (cca 15 keV) Resolution* @Pb- Kα (cca 75 keV)
Super Narrow SPM 2.5 – 4.0 100 – 110 0.7 – 1.5   3.5 – 7.0
Narrow SPM 2.5 – 4.0 160 – 180 0.8 – 1.3 – 3.0 – 3.8
CSM 6.0 – 1.5 1.5 12.0
Broad SPM 5.0 – 6.5 260 – 290 1.6 – 2.0 – 3.3 – 4.0
CSM 8.0 – – 2.3 5.8


Typical values for 1000 µm CdTe sensor, TA = 20°C

Range Mode Min Energy [keV] Max Energy [keV] Resolution*@Cu- Kα (cca 8 keV) Resolution* @Zr- Kα (cca 15 keV) Resolution* @Pb- Kα (cca 75 keV)
Super Narrow SPM 5.0 – 10        
CSM 10 – 20        
Narrow SPM 5.0 – 10        
CSM 10 – 20        
Broad SPM 5.0 – 10        
CSM 10 – 20        

*resolution in Sigma of gaussian

Sensor parameters

Sensor material

Symbol Parameter Si CdTe Units Comment
  Thickness 300 1000 1000 µm  
Vbias Bias Voltage 200 500 -450 V Max
  Typical detectable energy range for X-rays* up to 60 up to 600 keV See chart below
  Pixel size 55 x 55**   µm2  

*to get true detector response, detectable energy and quantum efficiency of sensor chip has to be combined with energy range of readout chip (see chapter “Energy range and resolution”)

** Pixels on tile borders are 2.5 times larger in one direction. The corner tile pixels are 2.5 times larger in both directions.

Device description

USB connector

USB type A, Standard USB 2.0 Full-Speed, in IP68 protection.

+24VDC connector

Main power supply (via standard M8 connector with 3 female contacts) Connect after plugging USB connector.

Synchronization interface

Two 4-pin M8 connectors (female for outputs and male for input) serve as synchronization interface, allowing to synchronize WIDEPIX2(1)x5 – MPX3 detector with external processes. Four signals are available:

  • Ready in – measurement is not possible, when signal at logical zero
  • Trigger in – logical zero starts shutter (measurement)
  • Ready out – logical one if device is ready to for new shutter
  • Trigger out – mirrors shutter (logical zero when shutter is active)

All signals are TTL compatible and 5V tolerant. For detailed description see Synchronization Guide.

Sync. Outputs

(M8-4Female)

Sync. Inputs

(M8-4Male)
Pin Signal Pin Signal
1 Gnd 1 Gnd
2 Ready Out 2 Trigger In
3 Trigger Out 3 Ready In
4 Reserved 4 Reserved

Water cooling interface

It is mandatory to cool down detector when in operation. WIDEPIX2(1)x5 – MPX3 uses water connectors that allow for quick disconnection/reconnection. Mating connector is included as standard accessories and has to be attached to 4x6mm plastic hose.

Mechanical dimensions

All dimensions are in mm.

Sensitive Area

1 Operating parameters: Shutter time=1ms, Mode = CSM or SPM-1Ch 12bit resolution.
2 During Readout time (or Dead time), no charge is collected from the sensor.
3 Except CSM mode Silicon sensor.

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