Advacam’s AdvaPIX QUAD camera contains four single Timepix3 devices with a quick parallel readout with a 2.04 mm diameter central opening that allows the beam to pass through the device without any interruption. The sensor layout is designed with a small offset for chips making a square space of 39 x 39 pixels in the sensor center for drilling a hole. The AdvaPIX QUAD features a sustainable frame rate of up to 1300 frames/ second.


Each Timepix3 device has an independent USB 3.0 communication channel that assures fast read-out of the complete system. All modules in the system are operated synchronously and triggered independently. The fast modules with Si or CdTe pixel detectors Timepix3 can be also used in different configurations such as stack of many layers or tiling to cover larger area or combination of both.The thickness and type of sensor can be customized as per requirements.

Advacam’s AdvaPIX QUAD is specially designed to perform both Wide Angle X-ray Scattering (WAXS) and Small Angle X-ray Scattering (SAXS). The open space in the center of the camera completely eliminates the need of a beam stop in front of the camera.
  • Sensor Material: Si or CdTe
  • Sensor Thickness: 100 μm, 300 μm and 500 μm for Si; 1 mm for CdTe
  • Sensitive Area: 28 mm x 28 mm
  • Number of Pixels: 512 x 512
  • Pixel Pitch: 55 μm
  • Resolution: 9 lp/mm
  • Readout Speed: 1300 frames/s
  • Photon Counting Speed: Up to 3 x106 photons/s/pixel
  • Threshold Step Resolution: 0.1 keV
  • Energy Resolution: 0.8 keV (THL) and 2 keV (ToT)
  • Min Detectable Energy: 5 keV for X-rays
  • Readout Chip: Timepix3
  • Pixel Mode of Operation: Counting, Time-over-Threshold, Time-of -Arrival
  • Connectivity: USB 3.0
  • Weight: 1500 g
  • Dimensions: 260 x 250 x 35 (Hole is 2.04 mm diameter)
  • Software: Pixet PRO

Device parameters

An instant development of new imaging structures in ADVACAM results in a new line of detectors optimized for XRD, SAXS or similar tasks where a primary pencil beam of radiation needs to pass through the detector without interaction. For this purpose we developed a Quad detector with monolithic sensor with central hole as shown in pictures below.

The detector consists of four Timepix or Timepix3 readout chips flip-chip bonded to single monolithic silicon sensor. The sensor layout is designed with small offset for chips making a square space of 39 x 39 pixels in the sensor center for drilling a hole. The hole diameter is 2.04 millimeters.

These detectors are fabricated in several standard versions differing in thickness: 100, 300 and 500 micrometers. The other thicknesses are possible too.

The performance of these new quads is equivalent to standard single chip assemblies. The hole machined in the middle doesn’t affect the noise floor, stability, imaging nor spectral properties.

Readout electronics

There are multiple options for readout electronics: either ADVACAM’s existing readouts (four synchronized AdvaPIX TPX3 devices or four MiniPIX TPX3 in their flex versions) with independent readout channel for each chip or a brand new device AdvaPIX TPX3 Quad being currently intensively tested.

TheAdvaPIX TPX3 Quadhas been developed for Timepix3 version of Quad detector. It uses single USB3.0 interface providing synchronized operation of all four Timepix3 chips. The PiXet software is being adapted for this new device.

Detector mechanics: What shape suits your application best?

The final detector mechanics is being designed now. It addresses several simple requirements:

  • electronics placed aside of sensitive area (similarly to AdvaPIX),
  • minimum amount of material behind sensors,
  • completely free path for primary X-ray beam passing through the hole,
  • vacuum compatibility,
  • attachable heatsink for temperature stabilization of Timepix3 chips.

Any suggestions, remarks or requirements for mechanical design are very welcome! (maximal sizes, connector types, mounting holes placement …).

Primary application: XRD/SAXS

The functional properties of Timepix3 detectors for Energy Dispersive XRD is described in the following link. There are clear benefits: Photon counting with energy discrimination, high spatial resolution of 55 micrometers (or better), fully spectral mode, effective suppression of radiation background and compact size.

The need for beam-stop reduces sensitive area of the imaging detector and limits the maximal energy to be used for XRD of heavy samples since higher energy penetrates the beam-stop.

The Quad Timepix3 detector with central hole offers 4 times larger solid angle coverage and does not require the beam-stop. The X-ray beam transmitted through the sample passes through the hole in the sensor and can be detected downstream with additional detector bringing additional information.

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